DeepCool has launched its award-winning AK700 VC. Honoured with both the 2026 iF Design Award and Red Dot Design Award, the AK700 VC is powered by VC 2.0 technology, redefining single-tower cooling with seven heat pipes and enhanced heat transfer for demanding performance.
Powered by a next-generation vapour chamber base, the AK700 VC spreads heat faster and more evenly for exceptional thermal efficiency. Rated to handle up to 300W TDP, it delivers stable, high-performance cooling for today’s most demanding CPUs.
The offset heat pipe design maximizes compatibility, offering greater clearance for high-profile memory and an unobstructed view of the RAM.
The AK700 VC features an advanced 3-phase, 10-pole, 12-slot fan motor with CoreAlign Winding for smoother, quieter, and more efficient operation. High-precision balancing minimizes vibration, while 0-RPM Startup/Stop ensures silent operation at idle.
The AK700 VC pairs a Vapour Chamber 2.0 base with seven heat pipes and a high-density single-tower heatsink for powerful cooling, while its offset layout and magnetic top cover simplify installation and improve compatibility.
Its supporting sockets include: Intel: LGA1851/1700/1200/115X and AMD: AM5/AM4.
At a glance, its key features include: Next-gen vapour chamber power; Advanced 3-phase, 10-pole, 12-slot fan motor; CoreAlign winding technology
