Flex, a global manufacturing leader and innovator in data centre infrastructure solutions, has forged a new partnership with LG Electronics (LG) to jointly develop integrated, modular cooling solutions that address the escalating thermal management challenges of AI-era data centres.
Advanced cooling technologies are required for more efficient heat dissipation in high-density data centres. The partnership brings together Flex’s liquid cooling portfolio, proprietary power products, and IT infrastructure solutions with LG’s high-performance air and liquid cooling modules, including CRAC, CRAH, chillers, Coolant Distribution Units (CDUs), and full suite of thermal management and monitoring solutions. This gives data centre operators the agility to customise solutions and scale with demand.
Commenting on the partnership, Michael Hartung, President and Chief Commercial Officer, Flex, informed, “Through our collaboration with LG, Flex now offers customers a complete range of cooling solutions to tackle escalating heat challenges in the data centre. Together, we’ll deliver prefabricated, scalable data centre infrastructure solutions that incorporate advanced liquid and air-cooling technologies to increase efficiency, simplify deployment, and speed time to revenue for our customers.”
