ZutaCore, a leader in waterless, direct-to-chip, two-phase liquid cooling has recently launched its Waterless End-of-Row (EOR) Coolant Distribution Unit (CDU) family, featuring 1.2MW and 2MW systems that deliver breakthrough performance and scalability for AI and High-Performance Computing (HPC) environments.
As the AI revolution drives unprecedented compute density, ZutaCore’s new EOR CDU family provides a smarter, centralised approach to liquid cooling, supporting multiple racks from a single unit while maintaining rack-level monitoring and control. This innovative design reduces infrastructure duplication, lowers total cost of ownership, and enables true waterless operation inside the white space, addressing the dual challenge of performance and sustainability facing modern data centers.
Using ZutaCore’s patented two-phase, direct-to-chip cooling technology and a low-GWP dielectric heat transfer fluid, the EOR CDU rejects aggregated heat into the facility, eliminating the risk of leaks or condensation. The result is higher thermal efficiency, lower energy use, and safer operation – even at the extreme power densities demanded by AI and HPC workloads.
Explaining in details, My Truong, CTO, ZutaCore, said, “Our new End-of-Row CDU family gives operators the control, intelligence and reliability required to scale sustainably. By integrating advanced cooling physics with modern RESTful APIs for remote monitoring and management, we’re enabling data centres to unlock new performance levels without compromising uptime or efficiency.”
