JetCool has recently launched its SmartPlate System for Dell PowerEdge R770 and R7725 servers. Designed to help enterprises and edge operators achieve more compute density per rack, the direct-to-chip solution supports next-generation platforms powered by 5th Gen AMD EPYC and Intel Xeon 6 processors.
SmartPlate systems are proven to deliver an average 13% IT power reduction, helping maximize power and floor space in new builds and existing facilities. Fully sealed and ready to install, the system improves thermal performance without facility water or data center retrofits, providing a fast, low-disruption way to adopt direct-to-chip cooling in enterprise data centers and distributed edge locations.
Commenting on the product, John Sasser, Chief Technology Officer at JetCool partner Sabey Data Centers, said, “With firsthand experience deploying the SmartPlate System, we’ve seen how it enables direct-to-chip liquid cooling within traditional air-cooled data centers. Using a closed-loop design, it integrates directly into the server, allowing fast, phased deployment. SmartPlate System helps improve server performance and reduce power consumption, giving customers a practical way to increase compute density and maximize their electricity and space budgets.”
Expressing their view, Dr. Bernie Malouin, Founder of JetCool and Vice President at Flex, said, “By bringing SmartPlate support to Dell PowerEdge R770 and R7725 servers, we’re giving enterprises and edge operators a faster path to higher rack density and better efficiency, without requiring changes to existing facilities.”
