LG Electronics (LG) has unveiled a comprehensive lineup of cooling solutions at the Data Center World (DCW) 2025 conference in Washington, D.C., from April 14-17.
This marks LG’s debut at DCW, where the company has presented an array of advanced data center cooling solutions, including high-performance chillers, air- and liquid-based server cooling products, and the LG Building Energy Control (BECON) solution. With its high-efficiency Direct-to-Chip (D2C) cooling technologies and integrated AI-powered control software, LG aims to make significant inroads into North America’s rapidly growing data center market.
AI data centers generate more heat and consume more electricity than conventional data centers due to higher server-rack density and the increased usage of resource-intensive computer chips, such as graphics processing units and high-bandwidth memory. LG’s hybrid solution, which combines chip cooling and room cooling, is designed to meet the thermal management needs of these next-gen facilities, delivering outstanding performance and top-tier energy efficiency. Visitors to the LG booth at DCW have learned all about the company’s tailored cooling solutions for AI data centers and witnessed the commitment to innovation that has propelled LG to the forefront of the global HVAC industry.
LG’s exhibition highlights the company’s liquid server cooling solutions featuring D2C technology; a remarkable innovation that applies cooling directly to the servers’ chips.
