nVent Electric plc, a global leader in electrical connection and protection solutions, has recently launched its new, modular data center liquid cooling solutions aligned to chip manufacturers’ current and future cooling requirements. The new solutions include enhanced Coolant Distribution Unit (CDU) offerings with new row and rack-based CDUs alongside advanced technology cooling system manifolds. They also include updated racks based on leading reference designs and a new services program.
nVent has showcased these solutions alongside its next-generation intelligent Power Distribution Units (PDUs) at SC25. At the show, nVent has also debut its new “We Do Cool Stuff” campaign and offer commentary on the evolution of liquid cooling alongside experts from NVIDIA, Lenovo, HPE and AMD.
Highlighting the company’s approach, Eric Osborn, GM of nVent Data Solutions, said, “We are tapping into our deep technical expertise, and working collaboratively with chip manufacturers and the broader ecosystem, to solve our customers’ unique challenges with these new liquid cooling and power solutions. “Our commitment to leading innovation for next-generation AI chips is at the core of the work we have done in the space for more than a decade.”
