3M has expanded its line of boron nitride cooling fillers applicable to a wide array of automotive, electrical and electronic devices and components. Boron nitride is a material consisting of boron and nitrogen well-known among chemists for its thermal stability and conductivity. The new grades from 3M are: Boron Nitride Cooling Filler Agglomerates CFA 100 and Boron Nitride Cooling Filler Agglomerates CFA 150.
Both consist of soft boron nitride agglomerates used to enhance isotropic thermal conductivity. They provide better through-plane conductivity than platelets or flakes, and their softness helps facilitate low impact on viscosity and easy processing that is less abrasive on equipment.
Boron nitride cooling filler agglomerates from 3M can be added to potting resins, conformable TIM foils or pads and other applications, where isotropic thermal conductivity is important. They are also used for bond lines of 150–200 µm (100 grade) and 200 µm or above (150 grade).
To maintain long-term reliability and efficiency, many modern devices require advanced materials to transfer excess heat and dissipate it to the surrounding air. Examples include laptops and smartphones as well as high-capacity batteries and motors used in electric or hybrid vehicles.
