Where high currents flow, electronic systems can overheat. This is why effective cooling is crucial to the efficiency and performance of electronic components. Infineon, the semiconductor solutions supplier, and thermal management specialist MAHLE have pooled their expertise. For the development of Infineon’s new high-performance EasyPACK S module, MAHLE is supplying a cooler tailored specifically to meet the requirements of Infineon.
The module controls electric switchgear and functions and can be used, for example, to control the power supply systems of data centers. Thanks to innovative cooling from MAHLE, the performance of the Infineon module has been significantly boosted compared with its predecessors. At the same time, Infineon can improve the functional endurance and durability of its product.
Commenting on the development, Christian Kuechlin, Vice President, MAHLE Industrial and Special Solutions, said, “Cooperation with Infineon is a further example of the way MAHLE is successfully transferring its competence developed in the automotive industry to other applications. MAHLE is driving strong growth in its non-automotive business by leveraging its automotive expertise.”
The new power module from Infineon offers high performance density in a small space. The cooling unit developed by MAHLE, which is about the size of two chocolate bars on top of each other, is installed directly on the circuit board and effectively dissipates heat from the modules using a coolant.
